Personal Information
Associate professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates
Paper Publications
- Electrical Modeling And Analysis of Polymer-cavity Through-silicon Vias:2017 IEEE Electrical Design of Advanced Packaging And Systems Symposium (edaps),2017
- Qijun Lu, Jianqin Deng*, Guangbao Shan, and Zhangming Zhu,Wideband Compact Power Amplifier Based on Novel Spatial Power Combining Technique for Millimeter-Wave Applications.[J]:Microwave and Optical Technology Letters,2021,63(1):160-165
- Milimeter-Wave Antenna-in-Package Applications Based on D263T Glass Substrate.[J]:IEEE Access,2020,8:67921-67928
- Qijun Lu, Zhangming Zhu*, Guangbao Shan, Yang Liu, Xiaoxian Liu, Xiangkun Yin,3-D Compact 3-dB Branch-Line Directional Couplers Based on Through-Silicon Via Technology for Millimeter-Wave Applications.[J]:IEEE Transactions on Components, Packaging and Manufacturing Technology,2019,9(9):1855-1862
- Through-Silicon Capacitor Interconnection for High Frequency 3-D Microsystem.[J]:IEEE Transactions on Components, Packaging and Manufacturing Technology,2019,9(7):1310-1318
- Qijun Lu, Zhangming Zhu*, Yang Liu, Xiaoxian Liu, Xiangkun Yin,Wideband Electromagnetic Modeling of Coaxial-Annular Through-Silicon Vias.[J]:IEEE Transactions on Electromagnetic Compatibility,2018,60(6):1915−1922
- A 110-170 GHz Spatial Power-Combined Frequency Tripler with 5.7%-7.8% Efficiency and 0.5 W Power Handling.[J]:Microwave and Optical Technology Letters,2018,60(5):1079-1085
- Qijun Lu, Zhangming Zhu*, Yintang Yang, Ruixue Ding, Yuejin Li,Closed-Form Internal Impedance Model and Characterization of Mixed Carbon Nanotube Bundles for Three-Dimensional Integrated Circuits.[J]:Chinese Physics B,2018,27(1):017303
- Qijun Lu, Zhangming Zhu*, Yintang Yang, Ruixue Ding, Yuejin Li,High-Frequency Electrical Model of Through-Silicon Vias for 3-D Integrated Circuits Considering Eddy Current and Proximity Effects.[J]:IEEE Transactions on Components, Packaging and Manufacturing Technology,2017,7(12):2036−2044
- Qijun Lu, Zhangming Zhu*, Yintang Yang, Ruixue Ding, Yuejin Li,Electrical Modeling and Analysis of Cu-CNT Heterogeneous Coaxial Through-Silicon Vias.[J]:IEEE Transactions on Nanotechnology,2017,16(4):695−702
- Qijun Lu, Zhangming Zhu*, Yintang Yang, Ruixue Ding,Analysis of Propagation Delay and Repeater Insertion in Single-Walled Carbon Nanotube Bundle Interconnects.[J]:Microelectronics Journal,2016,54:85-92
- Qijun Lu, Zhangming Zhu*, Yintang Yang, Ruixue Ding,Electrical Modeling and Characterization of Shield Differential Through-Silicon Vias.[J]:IEEE Transactions on Electron Devices,2015,62(5):1544-1552
- Qijun Lu, Zhangming Zhu*, Yintang Yang, Ruixue Ding,Influence of Temperature on the Conductivity of Multi-walled Carbon Nanotube Interconnects.[J]:Chinese Physics Letters,2015,32(4):047305
- Qijun Lu, Zhangming Zhu*, Yintang Yang, Ruixue Ding,Accurate Formulas for the Capacitance of Tapered-Through Silicon Vias in 3-D ICs.[J]:IEEE Microwave and Wireless Components Letters,2014,24(5):294−296
- Qijun Lu, Zhangming Zhu*, Yintang Yang, Ruixue Ding,Type of Distortionless Through Silicon Via Design Based on the Multiwalled Carbon Nanotube.[J]:IET Micro & Nano Letters,2013,8(12):869−871
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