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Institution:微电子学院

Title of Paper:Wideband Electromagnetic Modeling of Coaxial-Annular Through-Silicon Vias

Journal:IEEE Transactions on Electromagnetic Compatibility

First Author:Qijun Lu, Zhangming Zhu*, Yang Liu, Xiaoxian Liu, Xiangkun Yin

Indexed by:Journal paper

Document Code:000443149000039

Discipline:Engineering

First-Level Discipline:Electronics Science and Technology

Document Type:J

Volume:60

Issue:6

Page Number:1915−1922

Translation or Not:No

Date of Publication:2018-12-01

Included Journals:SCI

Date:2018-12-03