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Institution:微电子学院

Title of Paper:Through-Silicon Capacitor Interconnection for High Frequency 3-D Microsystem

Journal:IEEE Transactions on Components, Packaging and Manufacturing Technology

Indexed by:Journal paper

Correspondence Author:Guangbao Shan, Qijun Lu*, Song Liu, YintangYang

Document Code:000476786000011

Discipline:Engineering

First-Level Discipline:Electronics Science and Technology

Document Type:J

Volume:9

Issue:7

Page Number:1310-1318

Translation or Not:No

Date of Publication:2019-07-01

Included Journals:SCI

Date:2020-10-16