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Institution:微电子学院

Title of Paper:3-D Compact 3-dB Branch-Line Directional Couplers Based on Through-Silicon Via Technology for Millimeter-Wave Applications

Journal:IEEE Transactions on Components, Packaging and Manufacturing Technology

First Author:Qijun Lu, Zhangming Zhu*, Guangbao Shan, Yang Liu, Xiaoxian Liu, Xiangkun Yin

Indexed by:Journal paper

Document Code:000504728300021

Discipline:Engineering

First-Level Discipline:Electronics Science and Technology

Document Type:J

Volume:9

Issue:9

Page Number:1855-1862

Translation or Not:No

Date of Publication:2019-09-01

Included Journals:SCI

Date:2020-10-15