Personal Information
Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates
Scientific Research
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Paper Publications
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- Electrical Modeling And Analysis of Polymer-cavity Through-silicon Vias:2017 IEEE Electrical Design of Advanced Packaging And Systems Symposium (edaps),2017
- Qijun Lu, Jianqin Deng*, Guangbao Shan, and Zhangming Zhu,Wideband Compact Power Amplifier Based on Novel Spatial Power Combining Technique for Millimeter-Wave Applications.[J]:Microwave and Optical Technology Letters,2021,63(1):160-165
- Milimeter-Wave Antenna-in-Package Applications Based on D263T Glass Substrate.[J]:IEEE Access,2020,8:67921-67928
- Qijun Lu, Zhangming Zhu*, Guangbao Shan, Yang Liu, Xiaoxian Liu, Xiangkun Yin,3-D Compact 3-dB Branch-Line Directional Couplers Based on Through-Silicon Via Technology for Millimeter-Wave Applications.[J]:IEEE Transactions on Components, Packaging and Manufacturing Technology,2019,9(9):1855-1862
- Through-Silicon Capacitor Interconnection for High Frequency 3-D Microsystem.[J]:IEEE Transactions on Components, Packaging and Manufacturing Technology,2019,9(7):1310-1318
- Qijun Lu, Zhangming Zhu*, Yang Liu, Xiaoxian Liu, Xiangkun Yin,Wideband Electromagnetic Modeling of Coaxial-Annular Through-Silicon Vias.[J]:IEEE Transactions on Electromagnetic Compatibility,2018,60(6):1915−1922
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