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Institution:微电子学院

Title of Paper:Accurate Formulas for the Capacitance of Tapered-Through Silicon Vias in 3-D ICs

Journal:IEEE Microwave and Wireless Components Letters

First Author:Qijun Lu, Zhangming Zhu*, Yintang Yang, Ruixue Ding

Indexed by:Journal paper

Document Code:000336090100002

Discipline:Engineering

First-Level Discipline:Electronics Science and Technology

Document Type:J

Volume:24

Issue:5

Page Number:294−296

Translation or Not:No

Date of Publication:2014-05-01

Included Journals:SCI

Date:2018-12-03