kHa8uWJfMRQsfcMH8vqCO8YYeLpf51nQEr9w3EXstUYo9SX0xyYLRjNewxCB
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Electrical Modeling and Analysis of Cu-CNT Heterogeneous Coaxial Through-Silicon Vias

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Institution:微电子学院

Title of Paper:Electrical Modeling and Analysis of Cu-CNT Heterogeneous Coaxial Through-Silicon Vias

Journal:IEEE Transactions on Nanotechnology

First Author:Qijun Lu, Zhangming Zhu*, Yintang Yang, Ruixue Ding, Yuejin Li

Indexed by:Journal paper

Document Code:000405391100022

Discipline:Engineering

First-Level Discipline:Electronics Science and Technology

Document Type:J

Volume:16

Issue:4

Page Number:695−702

Translation or Not:No

Date of Publication:2017-07-01

Included Journals:SCI

Date:2018-12-03

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