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Institution:微电子学院

Title of Paper:High-Frequency Electrical Model of Through-Silicon Vias for 3-D Integrated Circuits Considering Eddy Current and Proximity Effects

Journal:IEEE Transactions on Components, Packaging and Manufacturing Technology

First Author:Qijun Lu, Zhangming Zhu*, Yintang Yang, Ruixue Ding, Yuejin Li

Indexed by:Journal paper

Document Code:000418771500013

Discipline:Engineering

First-Level Discipline:Electronics Science and Technology

Document Type:J

Volume:7

Issue:12

Page Number:2036−2044

Translation or Not:No

Date of Publication:2017-12-01

Included Journals:SCI

Date:2018-12-03