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个人信息Personal Information
教授 博士生导师 硕士生导师
任职 : 校学术委员会副主任
性别：男
毕业院校：西安交通大学
学历：博士研究生毕业
学位：博士研究生毕业
在职信息：在岗
所在单位：微电子学院
招生院系： 微电子学院
入职时间：1984-07-01
学科：集成电路系统设计. 微电子学与固体电子学. 材料物理与化学
办公地点：西安电子科技大学 北校区科技楼A703
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- Li Di; Jing Zhan; Yang Yin-tang; Wu Xiao-feng; Shi Zuo-chen; Liu Yang,Third-order active-RC complex filter with automatic frequency tuning for ZigBee transceiver applications:JOURNAL OF CENTRAL SOUTH UNIVERSITY,2015,22(3):966-973
- Yang, Zheng ; Wang, Jing-Min ; Li, Ya-Ni ; Yang, Yin-Tang ,A low-input DC/DC converter for energy harvesting:Beijing Youdian Daxue Xuebao/Journal of Beijing University of Posts and Telecommunications,2016,39(1):92-95
- Shi, Zuochen; Yang, Yintang; Li, Di,A low-power ADC with compact AGC loop for LR-WPAN receivers:ANALOG INTEGRATED CIRCUITS AND SIGNAL PROCESSING,2015,84(1):9-18
- Shi Zuochen^Yang Yintang^Li Di^Liu Yang,A Fully-Integrated Low-Power Analog Front-End for ZigBee Transmitter Applications:CHINESE JOURNAL OF ELECTRONICS,2016,25(3):424-431
- Yang, Yin-Tang^Shi, Zuo-Chen^Li, Di^Wang, Yu,Design of a fully integrated receiver analog baseband chain for 2.4-GHz ZigBee applications:MICROELECTRONICS JOURNAL,2016,52:31-39
- Ding, Can; Guo, Y. Jay; Qin, Pei-Yuan; Yang, Yintang,A Compact Microstrip Phase Shifter Employing Reconfigurable Defected Microstrip Structure (RDMS) for Phased Array Antennas:IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION,2015,63(5):1985-1996
- Yang Yintang; Wu Ruizhen; Zhang Li; Zhou Duan,An Asynchronous Adaptive Priority Round-Robin Arbiter Based on Four-Phase Dual-rail Protocol:CHINESE JOURNAL OF ELECTRONICS,2015,24(1):1-7
- Wang, Jingmin ; Yang, Zheng ; Yang, Yintang ,Highly efficient interface circuit for vibrational energy harvesting applications:Xi'an Dianzi Keji Daxue Xuebao/Journal of Xidian University,2015,42(6):118-123
- Yang, Yintang ; Yuan, Jun ; Zhang, Zhaofeng ,Continuous time 危螖ADC design with 256 MHz sampling and 71 dB DR:Xi'an Dianzi Keji Daxue Xuebao/Journal of Xidian University,2015,42(1):10-15
- Yang, Yintang^Zheng, Junping^Dong, Gang^Zhao, Yingbo^Mei, Zheng^Zhu, Weijun,New coaxial through silicon via (TSV) applied for three dimensional integrated circuits (3D ICs):IEICE ELECTRONICS EXPRESS,2016,13(8)