Hits:

Title:一种基于多径分量重建残差的目标检测方法

Institution:空间科学与技术学院

First Author:CHE

Type of Patent:发明

State of Patent:实审

Application Number:CN202411001617.5

Authorization Number:CN202411001617.5

Number of Inventors:8

Service Invention or Not:No

Application Date:2024-07-25

Date:2024-08-07