西安电子科技大学主页平台管理系统 Yang Yintang New coaxial through silicon via (TSV) applied for three dimensional integrated circuits (3D ICs) Home

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New coaxial through silicon via (TSV) applied for three dimensional integrated circuits (3D ICs)

Release Time:2018-06-08 Hits:

Institution:微电子学院
Journal:IEICE ELECTRONICS EXPRESS
First Author:Yang, Yintang^Zheng, Junping^Dong, Gang^Zhao, Yingbo^Mei, Zheng^Zhu, Weijun
Document Code:SCI WOS:000377764100014
Volume:13
Issue:8
ISSN:1349-2543
Translation or Not:No
Date of Publication:2016-01-01
Included Journals:SCI

Yang Yintang

Personal Information

Name (Simplified Chinese):杨银堂
Name (English):Yang Yintang
Name (Pinyin):YANGYINTANG
Date of Employment:1984-11-01
School/Department:微电子学院
Administrative Position:无
Education Level:With Certificate of Graduation for Doctorate Study
Business Address:西安电子科技大学北校区科技楼A703
Gender:Male
Contact Information:
Professional Title:Professor
Status:On duty
Other Post:校学术委员会副主任
Alma Mater:西安交通大学
Discipline:Integrated Circuit System Design,Microelectronics and Solid State Electronics,Materials Physics and Chemistry
Enrollment Department:微电子学院