Personal Information
Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates
Scientific Research
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Paper Publications
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- Temperature properties of the parasitic resistance of through-silicon vias (TSVs) in high-frequency 3-D ICs.[J]:IEICE Electronics Express
- Impedance matching for the reduction of signal reflection in high speed multilevel three-dimensional integrated chips.[J]:Journal of Semiconductors
- Reduction of signal reflection in high-frequency three-dimensional (3D) integration circuits.[J]:IEICE Electronics Express
- Electical models of through silicon vias and silicon-based devices for millimeter-wave application.[J]:International Journal of RF And Microwave Computer-aided Engineering
- Electrical modeling and analysis of differential dielectric-cavity through-silicon vias array.[J]:IEEE Microwave and Wireless Components Letters
- Wideband substrate integrated waveguide bandpass filter based on 3-D ICs.[J]:IEEE Trans. on Components, Packaging and Manufacturing Technology
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