Personal Information
Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates
Paper Publications
- Temperature properties of the parasitic resistance of through-silicon vias (TSVs) in high-frequency 3-D ICs.[J]:IEICE Electronics Express
- Impedance matching for the reduction of signal reflection in high speed multilevel three-dimensional integrated chips.[J]:Journal of Semiconductors
- Reduction of signal reflection in high-frequency three-dimensional (3D) integration circuits.[J]:IEICE Electronics Express
- Electical models of through silicon vias and silicon-based devices for millimeter-wave application.[J]:International Journal of RF And Microwave Computer-aided Engineering
- Electrical modeling and analysis of differential dielectric-cavity through-silicon vias array.[J]:IEEE Microwave and Wireless Components Letters
- Wideband substrate integrated waveguide bandpass filter based on 3-D ICs.[J]:IEEE Trans. on Components, Packaging and Manufacturing Technology
- Liu, Xiaoxian^Zhu, Zhangming^Yang, Yintang^Ding, Ruixue,Low-Loss Air-Cavity Through-Silicon Vias (TSVs) for High Speed Three-Dimensional Integrated Circuits (3-D ICs):IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS,2016,26(2):89-91
- Liu, Xiaoxian; Zhu, Zhangming; Yang, Yintang; Ding, Ruixue,A Model of Air-Gap Through-Silicon Vias (TSVs) for Microwave Applications:IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS,2015,25(8):493-495
- Liu, Xiaoxian; Zhu, Zhangming; Yang, Yintang; Ding, Ruixue,Parasitic Inductance of Non-Uniform Through-Silicon Vias (TSVs) for Microwave Applications:IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS,2015,25(7):424-426
- Liu, Xiaoxian^Zhu, Zhangming^Yang, Yintang^Ding, Ruixue^Li, Yuejin,Parasitic effects of air-gap through-silicon vias in high-speed three-dimensional integrated circuits:CHINESE PHYSICS B,2016,25(11)
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