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Fei Chunlong

Personal Information

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Male   Wuhan University   With Certificate of Graduation for Doctorate Study   Professor  

Education Background

2013.11 2015.10

  • University of Southern California
  • Biomedical Engineering
  • Joint PhD Program

2012.09 2015.12

  • Wuhan University
  • Condensed Matter Physics
  • Doctoral Degree in Science
  • With Certificate of Graduation for Doctorate Study

2006.09 2010.06

  • Wuhan University
  • Elite Program in Physics for Talent Training
  • Bachelor's Degree in Science
  • With Certificate of Graduation for Undergraduate Study

Work Experience

2025.09 2026.04
  • Xidian University
  • Faculty of Integrated Circuit
  • Professor
2019.08 2025.09
  • Xidian University
  • School of Microelectronics
  • Associate Professor
2016.01 2019.07
  • Xidian University
  • School of Microelectronics
  • Assistant Professor

Social AffiliationsMore>>

2024.05 Now

  • Member of the Acoustic Instruments Committee of China Instrument and Control Society

2022.12 Now

  • Expert of Xi'an Science and Technology Think Tank, Xi'an Association for Science and Technology

2023.01 Now

  • Consultant of the Technical Committee for Group Standards of the Additive Manufacturing Medical Devices Subcommittee, China Association for Medical Devices Industry (CAMDI)

2023.07 Now

  • Member of Xi'an Acoustical Society

2022.01 Now

  • Young Editorial Board Member, Journal of Advanced Dielectrics

2025.06 Now

  • IEEE Senior Member

Research Group

Name of Research Group:Integrated Ultrasonics Team
Description of Research Group:The Integrated Ultrasonics Team was established in early 2016. Leveraging the strength in integrated circuit technology from the School of Microelectronics, the team is dedicated to applying IC technology in ultrasonic medical applications, non-destructive testing, and energy. Key research areas include: Development and testing of high-frequency ultrasonic transducers and arrays; Design of application-specific integrated circuits (ASICs) for medical ultrasonic imaging; Development of high-resolution medical imaging systems; Integration and application of intelligent piezoelectric energy devices. By building platforms for material applications, device design, fabrication, characterization, and application, as well as ASIC design and development, the team aims to cultivate versatile and practice-oriented IC talents with combined hardware and software capabilities. These efforts are intended to advance IC technology in medical, non-destructive testing, energy, and semiconductor fields.